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6 Intel
®
E8500/8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Revision History
§
Document
Number
Revision
Number
Description Date
306749 001 • Initial release of this document March 2005
306749 002 • Added Intel® E8501 chipset specific information and re-titled document
• Added updated Intel® E8500 Chipset eXternal Memory Bridge (XMB)
thermal specification in Section 3.2
May 2006