Filter
Top Products
XMB Reference Thermal Solution
38 Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
8.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width and depth constraints typically placed on the E8500/E8501 chipset
XMB thermal solution are showing in Figure 8-2.
When using heatsinks that extend beyond the XMB reference heatsink envelope shown in
Figure 8-2, any motherboard components placed between the heatsink and motherboard cannot
exceed 2.48 mm (0.10 in.) in height.
8.4 Board-Level Components Keepout Dimensions
The locations of holes pattern and keepout zones for the reference thermal solution are shown in
Figure 8-3.
8.5 XMB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset XMB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok fasteners. Figure 8-4
shows the reference thermal solution assembly and associated components.
Figure 8-2. XMB Reference Heatsink Volumetric Envelope
Heatsink Fin
48.26 mm.
63.50mm.
45.50mm.
Heatsink Base
26.60 mm.
Motherboard
Heatsink Fin
4.5 mm.
2.60 mm.
FCBGA + Solder Balls
Die + TIM
30.26 mm.