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E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 25
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
6.4 Board-Level Components Keepout Dimensions
The location of hole pattern and keepout zones for the reference thermal solution are shown in
Figure 6-3.
Figure 6-2. First NB Reference Heatsink Volumetric Envelope
FCBGA + Solder Balls
TNB
Heatsink
42.50 mm.
42.50 mm.
Heatsink
Fin
Heatsink Base
64.52 mm.
64.52 mm.
Heatsink Base
IHS + TIM2
55.09 mm.
Motherboard
Heatsink
Fin
4 mm.
4.29 mm.