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E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 17
Bridge (XMB) Thermal/Mechanical Design Guide
4 Thermal Simulation
Intel provides thermal simulation models of the E8500/E8501 chipset NB/XMB components and
associated user's guides to aid system designers in simulating, analyzing, and optimizing their
thermal solutions in an integrated, system-level environment. The models are for use with the
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool
FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in
ICEPAK* format. Contact your Intel field sales representative to order the thermal models and
user's guides.
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