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Functional Architecture Intel
®
Compute Module MFS2600KI TPS
Revision 1.0
Intel order number: G51989-002
14
Table 5. RDIMM Support Guidelines (Preliminary. Subject to Change)
Ranks
Per
DIMM
and
Data
Width
Memory Capacity Per
DIMM1
Speed (MT/s) and Voltage Validated by
Slot per Channel (SPC) and DIMM Per Channel (DPC)2
1 Slot per Channel
2 Slots per Channel
1DPC
1DPC
2DPC
1.35V
1.5V
1.35V
1.5V
1.35V
1.5V
SRx8
1GB
2GB
4GB
1066,
1333
1066,
1333, 1600
1066, 1333
1066, 1333
1066
1066, 1333
DRx8
2GB
4GB
8GB
1066,
1333
1066,
1333, 1600
1066, 1333
1066, 1333
1066
1066, 1333
SRx4
2GB
4GB
8GB
1066,
1333
1066,
1333, 1600
1066, 1333
1066, 1333
1066
1066, 1333
DRx4
4GB
8GB
16GB
1066,
1333
1066, 1333
1066, 1333
1066
1066, 1333
QRx4
8GB
16GB
32GB
800
1066
800
1066
800
800
QRx8
4GB
8GB
16GB
800
1066
800
1066
800
800
Notes:
1. Supported DRAM Densities are 1Gb, 2Gb, and 4Gb. Only 2Gb and 4Gb are validated by Intel
®
.
2. Command Address Timing is 1N
Supported and Validated
Supported but not Validate
TBD
Table 6. LRDIMM Support Guidelines (Preliminary. Subject to Change)
Ranks
Per
DIMM
and Data
Width1
Memory Capacity Per
DIMM2
Speed (MT/s) and Voltage Validated by
Slot per Channel (SPC) and DIMM Per Channel (DPC)3,4,5
1 Slot per Channel
2 Slots per Channel
1DPC
1DPC and 2DPC
1.35V
1.5V
1.35V
1.5V
QRx4
(DDP)6
16GB
32GB
1066, 1333
1066, 1333
1066
1066, 1333
QRx8
(P)6
8GB
16GB
1066, 1333
1066, 1333
1066
1066, 1333
Notes:
1. Physical Rank is used to calculate DIMM Capacity
2. Supported and validated DRAM Densities are 2Gb and 4Gb
3. Command address timing is 1N
4. The speeds are estimated targets and will be verified through simulation
5. For 3SPC/3DPC – Rank Multiplication (RM) >=2
6. DDP – Dual Die Package DRAM stacking. P – Planar monolithic DRAM Dies.