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Intel Mobile Board MGM45WU Product Guide
84
Lead-free 2LI/Pb-free 2LI Board
The electronics industry is transitioning to European Union (EU) Restriction of
Hazardous Substances (RoHS)-compliant products. The RoHS legislation restricts the
use of six materials. One of these restricted materials is lead. Lead is the most
common and problematic of the RoHS restricted materials.
There are exemptions in RoHS that allow the use of lead in some very limited locations
in electronic products. Maximum lead concentration values have been established for
RoHS-compliant electronic products that allow up to 1000 ppm of lead.
Lead-free/Pb-free is a nickname that is often used (or misused) for RoHS-compliant
products. In this case, the term "Lead-free/Pb-free" means that lead has been
removed where required by the RoHS legislation but still may exist as an impurity
below 1000 ppm.
The term "Lead-free 2LI/Pb-free 2LI" means lead-free second level interconnect (2LI).
The balls, leads, or pads used to connect the component to a printed circuit board are
lead-free, but the first level interconnect (FLI) is not lead-free. The use of lead in the
FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect
exemption.
Intel Mobile Board MGM45WU is a lead-free second level interconnect product.
Table 16 shows the lead-free second level interconnect
marks as they appear on the
board and accompanying collateral. These marks are based on JEDEC standard
J-STD-609, “Marking and Labeling of Components, PCBs and PCBAs to Identify Lead,
Lead Free and Other Attributes.”
For more information concerning Intel’s lead-free initiatives, refer to
http://www.intel.com/technology/silicon/leadfree.htm
.