Filter
Top Products
Regulatory Compliance
85
Table 16. Lead-Free Second
Level Interconnect Marks
Description Mark
This symbol is used to identify
electrical and electronic
assemblies and components in
which the Pb concentration
level in the board substrate
and the solder connections
from the board to the
components (second-level
interconnect) is not greater
than 0.1% by weight
(1000 ppm).
or
or
Restriction of Hazardous Substances (RoHS)
EU RoHS
EU RoHS Directive 2002/95/EC restricts the use of the following six materials in
various types of electronic and electrical equipment:
• Lead
• Mercury
• Cadmium
• Hexavalent chromium
• Polybrominated biphenyls (PBB)
• Polybrominated diphenyl ether (PBDE)
The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium,
which is limited to 0.01% or 100 ppm) by weight of homogeneous material.
Intel Mobile Board MGM45WU complies with these restrictions.