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CY7C63310, CY7C638xx
Document 38-08035 Rev. *K Page 75 of 83
29. Ordering Information
Ordering Code FLASH Size RAM Size Package Type
CY7C63310-PXC 3K 128 16-PDIP
CY7C63310-SXC 3K 128 16-SOIC
CY7C63801-PXC 4K 256 16-PDIP
CY7C63801-SXC 4K 256 16-SOIC
CY7C63803-SXC 8K 256 16-SOIC
CY7C63803-SXCT 8K 256 16-SOIC, Tape and Reel
CY7C63813-PXC 8K 256 18-PDIP
CY7C63813-SXC 8K 256 18-SOIC
CY7C63823-QXC 8K 256 24-QSOP
CY7C63823-SXC 8K 256 24-SOIC
CY7C63823-SXCT 8K 256 24-SOIC, Tape and Reel
CY7C63823-XC 8K 256 Die form
CY7C63833-LFXC 8K 256 32-QFN
CY7C63833-LTXC 8K 256 32-QFN Sawn
CY7C63833-LTXCT 8K 256 32-QFN Sawn, Tape and Reel
30. Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may
degrade device reliability.
Parameter Description Min Typical Max Unit
T
BAKETEMP
Bake Temperature 125 See package label °C
T
BAKETIME
Bake Time See package label 72 hours
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