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Document 38-08035 Rev. *K Page 77 of 83
Figure 31-3. 18-Pin (300-Mil) Molded DIP P3
Figure 31-4. 18-Pin (300-Mil) Molded SOIC S3
DIMENSIONS IN INCHES
MIN.
MAX.
SEATING PLANE
0.240
0.270
0.030
0.060
0.870
0.920
0.140
0.190
0.090
0.110
0.055
0.065
0.015
0.020
0.120
0.140
0.015
0.060
0.009
0.012
0.310
0.385
0.300
0.325
0.115
0.160
3° MIN.
19
10 18
PART #
LEAD FREE PKG.
STANDARD PKG.
PZ18.3
P18.3
51-85010 *B
PIN 1 ID
SEATING PLANE
0.447[11.353]
0.463[11.760]
19
10 18
*
*
*
DIMENSIONS IN INCHES[MM]
MIN.
MAX.
0.291[7.391]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
REFERENCE JEDEC MO-119
PART#
S18.3 STANDARDPKG.
SZ18.3LEAD FREEPKG.
51-85023-*B
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