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4–38 Maintenance and Service Guide
Removal and replacement procedures
Replace the thermal material:
The thermal material must be cleaned from the surfaces of the heat sink and the system board each time the heat
sink is removed. Replacement thermal material is included with fan, heat sink, and heat shield spare parts.
■ Thermal paste is used between the processor 1 and the heat sink section 2 that services it.
■ Thermal pads are used between the system board capacitors 3 and the heat sink section 4 that services it.
■ Thermal pads are used on the graphics subsystem memory module 5 and the heat sink section 6 that
services it.
✎
The first illustration shows thermal material locations on computer models that use the discrete graphics
subsystem. The second illustration shows the thermal material locations on computer models that use the UMA
graphics subsystem.
Reverse this procedure to install the fan and heat sink.