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Quad-Core Intel® Xeon® Processor 5400 Series TMDG 11
Introduction
§
T
CONTROL
A processor unique value for use in fan speed control mechanisms. T
CONTROL
is a
temperature specification based on a temperature reading from the processor’s Digital
Thermal Sensor. T
CONTROL
can be described as a trigger point for fan speed control
implementation. T
CONTROL
= -T
OFFSET
.
T
OFFSET
An offset value from the TCC activation temperature value programmed into each
processor during manufacturing and can be obtained by reading the
IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the
RS - Wolfdale Processor Family BIOS Writers Guide (BWG) for further details.
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor A feature on the processor that can keep the processor’s die temperature within factory
specifications under normal operating conditions.
Thermal Profile Line that defines case temperature specification of a processor at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
T
LA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
SA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
Table 1-2. Terms and Descriptions (Sheet 2 of 2)