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96 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Note: CEK771-02-1U is the 1U alternative reference heatsink design for Quad-Core Intel® Xeon® Processor
E5400 Series in volumetrically constrained form factors.
F.1.2 Additional Suppliers
The Intel enabled solutions for Quad-Core Intel® Xeon® Processor 5400 Series are
preliminary. The Intel enabled solutions have not been verified to meet the criteria
outlined in Appendix E. Customers can purchase the Intel enabled thermal solution
components from the suppliers listed in Tab le F-1and Tab le F-2.
For additional details, please refer to the Quad-Core Intel® Xeon® Processor 5400
Series thermal mechanical enabling components drawings in Appendix B.
CEK771-01-1U
(for 1U)
CEK Heatsink
Intel p/n C90546
rev02
Copper Fin, Copper
Base
Fujikura
CNDA# 1242012
(stacked fin)
Fujikura America
Ash Ooe
a_ooe@fujikura.com
408-748-6991
Fujikura Taiwan Branch
Yao-Hsien Huang
yeohsien@fujikuratw.com.tw
886(2)8788-4959
Thermal Interface
Material
See CEK771-01-2U
CEK Spring for
CEK771
See CEK771-01-2U
CEK771-02-1U
(for 1U)
CEK Low Cost
Heatsink for Mid
and Low Power
SKUs
Intel p/n D71537
Rev 02
Aluminum
Extrusion
Asia Vital
Components (AVC)
CNDA# AP5281
Steve Huang (APAC)
+86-755-3366-8888 x66888
+86-138-252-45215
steve@avc.com.cn
Huabin Chen (China Only)
+886-755-3366-8888 x66871
huabin@avc.com.cn
Thermal Interface
Material
See CEK771-01-2U
CEK Spring for
CEK771
See CEK771-01-2U
Table F-1. Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel
Reference Solution (Sheet 2 of 2)
Assembly Component Description
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