Filter
Top Products
Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3
Contents
1Introduction..............................................................................................................9
1.1 Objective ...........................................................................................................9
1.2 Scope ................................................................................................................9
1.3 References .........................................................................................................9
1.4 Definition of Terms ............................................................................................ 10
2 Thermal/Mechanical Reference Design.................................................................... 13
2.1 Mechanical Requirements ................................................................................... 13
2.1.1 Processor Mechanical Parameters ............................................................. 13
2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package............................ 14
2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations................... 18
2.2 Processor Thermal Parameters and Features ......................................................... 19
2.2.1 Thermal Control Circuit and TDP............................................................... 19
2.2.2 Digital Thermal Sensor............................................................................ 20
2.2.3 Platform Environmental Control Interface (PECI) ........................................ 21
2.2.4 Multiple Core Special Considerations ......................................................... 21
2.2.5 Thermal Profile ...................................................................................... 24
2.2.6 TCONTROL Definition .............................................................................. 25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon®
Processor 5400 Series............................................................................. 26
2.2.8 Performance Targets............................................................................... 28
2.3 Fan Fail Guidelines ............................................................................................ 32
2.4 Characterizing Cooling Solution Performance Requirements..................................... 33
2.4.1 Fan Speed Control.................................................................................. 33
2.4.2 Processor Thermal Characterization Parameter Relationships........................ 34
2.4.3 Chassis Thermal Design Considerations ..................................................... 36
2.5 Thermal/Mechanical Reference Design Considerations ............................................ 37
2.5.1 Heatsink Solutions.................................................................................. 37
2.5.2 Thermal Interface Material....................................................................... 38
2.5.3 Summary .............................................................................................. 38
2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 39
2.5.5 Thermal Solution Performance Characteristics ............................................ 41
2.5.6 Thermal Profile Adherence....................................................................... 42
2.5.7 Components Overview ............................................................................ 45
2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel®
Xeon® Processor 5400 Series Thermal Profile ............................................ 49
A 1U Alternative Heatsink Thermal/Mechanical Design............................................... 53
A.1 Component Overview......................................................................................... 53
A.2 Thermal Solution Performance Characterics .......................................................... 54
A.3 Thermal Profile Adherence.................................................................................. 54
B Mechanical Drawings ............................................................................................... 57
C Heatsink Clip Load Methodology .............................................................................. 83
C.1 Overview ......................................................................................................... 83
C.2 Test Preparation................................................................................................ 83
C.2.1 Heatsink Preparation .............................................................................. 83
C.2.2 Typical Test Equipment ........................................................................... 86
C.2.3 Test Procedure Examples ........................................................................ 86
C.2.4 Time-Zero, Room Temperature Preload Measurement ................................. 86
C.2.5 Preload Degradation under Bake Conditions ............................................... 87