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Thermal/Mechanical Reference Design
14 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package
The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip
land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel®
Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications. The
Quad-Core Intel® Xeon® Processor 5400 Series mechanical drawing shown in
Figure 2-1, Figure 2-2, and Figure 2-3 provide the mechanical information for the
Quad-Core Intel® Xeon® Processor 5400 Series. The drawing is superseded with the
drawing in the processor datasheet should there be any conflicts. Integrated package/
socket stackup height information is provided in the LGA771 Socket Mechanical Design
Guide.