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Thermal/Mechanical Reference Design
26 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Figure 2-9 depicts the interaction between the Thermal Profile and T
CONTROL
.
If the DTS temperature is less than T
CONTROL
, then the case temperature is permitted
to exceed the Thermal Profile, but the DTS temperature must remain at or below
T
CONTROL
. The thermal solution for the processor must be able to keep the processor’s
T
CASE
at or below the Thermal Profile when operating between the T
CONTROL
and
T
CASE_MAX
at TDP under heavy workload conditions.
Refer to Section 2.4.1 for the implementation of the T
CONTROL
value in support of fan
speed control (FSC) design to achieve better acoustic performance.
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon®
Processor 5400 Series
2.2.7.1 Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor
X5400 Series
The Quad-Core Intel® Xeon® Processor X5400 Series is designed to go into various
form factors, including the volumetrically constrained 1U and custom blade form
factors. Due to certain limitations of such form factors (i.e. airflow, thermal solution
height), it is very challenging to meet the thermal requirements of the processor. To
mitigate these form factor constraints, Intel has developed a dual Thermal Profile
specification, shown in Figure 2-10.
Figure 2-9. T
CONTROL
and Thermal Profile Interaction