Filter
Top Products
Quad-Core Intel® Xeon® Processor 5400 Series TMDG 53
1U Alternative Heatsink Thermal/Mechanical Design
A1U Alternative Heatsink
Thermal/Mechanical Design
Intel has also developed an 1U alternative reference heatsink design for the
volumetrically constrained form factor and targeted for the rack-optimized and ultra
dense SKUs. This alternative heatsink design meets the thermal profile specifications of
the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of
weight reduction and cost savings in using this alternative 1U heatsink.
This section describes the alternative heatsink thermal performance and adherence to
Quad-Core Intel® Xeon® Processor E5400 Series thermal profile specifications.
A.1 Component Overview
The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the
same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive
standoff/screws, Thermal Interface Material (TIM) and Spring.
Figure A-1 shows the isometric view of the 1U alternative heatsink.
Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink.
Figure A-1. Isometric View of the 1U Alternative Heatsink