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Quad-Core Intel® Xeon® Processor 5400 Series TMDG 91
Quality and Reliability Requirements
E Quality and Reliability
Requirements
E.1 Intel Verification Criteria for the Reference
Designs
E.1.1 Reference Heatsink Thermal Verification
The Intel reference heatsinks will be verified within specific boundary conditions using a
TTV and the methodology described in the Intel
®
Xeon
®
Dual- and Multi- Processor
Family Thermal Test Vehicle User's Guide.
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3σ value for thermal characterization parameter using real processors (based on the
TTV correction offset).
E.1.2 Environmental Reliability Testing
E.1.2.1 Structural Reliability Testing
The Intel reference heatsinks will be tested in an assembled condition, along with the
LGA771 Socket. Details of the Environmental Requirements, and associated stress
tests, can be found in the LGA771 Socket Mechanical Design Guide.
The use condition environment definitions provided in Appendix E-1are based on
speculative use condition assumptions, and are provided as examples only.