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Thermal/Mechanical Reference Design
42 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
2.5.6 Thermal Profile Adherence
The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A
for the Quad-Core Intel® Xeon® Processor 5400 Series. From Tab le 2- 4, the three-
sigma (mean+3sigma) performance of the thermal solution is computed to be 0.187
°C/W and the processor local ambient temperature (T
LA
) for this thermal solution is 40
°C. Hence, the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-8.y = 0.187*X + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-19 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile A
specification. The 2U+ CEK solution meets the Thermal Profile A with a 0.6°C margin at
the upper end (TDP). By designing to Thermal Profile A, it is ensured that no
measurable performance loss due to TCC activation is observed under the given
environmental conditions.
Figure 2-18. 1U CEK Heatsink Thermal Performance