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Quad-Core Intel® Xeon® Processor 5400 Series TMDG 45
Thermal/Mechanical Reference Design
Note: Intel has also developed an 1U alternative reference heatsink design. This
alternative heatsink design meets the thermal profile specifications of the
Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of
weight reduction and cost savings. Refer to Appendix B for detail information.
2.5.7 Components Overview
2.5.7.1 Heatsink with Captive Screws and Standoffs
The CEK reference heatsink uses snapped-fin technology for its design. It consists of a
copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The
mounting screws and standoffs are also made captive to the heatsink base for ease of
handling and assembly as shown in Figure 2-22 and Figure 2-23 for the 2U+ and 1U
heatsinks, respectively.
Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400
Series Thermal Profile
35
40
45
50
55
0510
15
20 25 30 35 40
45
50
55
60 65 70 75 80
Tcase (
C
)
T
CASE_MAX
@ TDP
1U CEK Reference Solution
Y = 0.246 * X + 40
Thermal Profile
Y = 0.298 * X + 43.2
60
65