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Thermal/Mechanical Reference Design
44 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile
specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From Ta ble 2 -7
the three-sigma (mean+3sigma) performance of the thermal solution is computed to
be 0.246 °C/W and the processor local ambient temperature (T
LA
) for this thermal
solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is
calculated as:
Equation 2-10.y = 0.246*X + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-21 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile
specification. The 1U CEK solution meets the Thermal Profile with 7.3°C margin at the
upper end (TDP). By designing to Quad-Core Intel® Xeon® Processor E5400 Series
Thermal Profile, it is ensured that no measurable performance loss due to TCC
activation is observed under the given environmental conditions.
Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile B
40
45
50
55
60
65
0510
15
20 25 30 35 40 45 50 55 60 65 70 75 80
Power (W)
Temperature (
C
)
Thermal Profile B
Y = 0.221 * X + 43.5
1U CEK Reference Solution
Y = 0.246 * X + 40
T
CASE_MAX_B
@ TDP
90 100 110
TDP
120
70