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Package Mechanical Specifications
116 Datasheet
9 Package Mechanical
Specifications
The processor is in a Flip-Chip Land Grid Array (FCLGA12) package that interfaces with
the baseboard using an LGA2011-0 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor
component thermal solutions, such as a heatsink. Refer to the Processor Thermal
Mechanical Specifications and Design Guidelines (see Related Documents section) for
complete details on the LGA2011-0 socket.
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