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Thermal Management Specifications
42 Datasheet
5 Thermal Management
Specifications
The processor requires a thermal solution to maintain temperatures within operating
limits. Any attempt to operate the processor outside these limits may result in
permanent damage to the processor and potentially other components within the
system. Maintaining the proper thermal environment is key to reliable, long-term
system operation.
A complete solution includes both component and system-level thermal management
features. Component-level thermal solutions can include active or passive heatsinks
attached to the processor Integrated Heat Spreader (IHS). Typical system-level
thermal solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component-level thermal solution, refer to the
Processor Thermal Mechanical Specifications and Design Guidelines (see Related
Documents section).
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