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Datasheet 65
Electrical Specifications
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors. These specifications are based on final silicon
characterization.
2. I
CC_TDC
(Thermal Design Current) is the sustained (DC equivalent) current that the processor is capable of drawing
indefinitely and should be used for the voltage regulator thermal assessment. The voltage regulator is responsible for
monitoring its temperature and asserting the necessary signal to inform the processor of a thermal excursion.
3. Specification is at T
CASE
= 50 C. Characterized by design (not tested).
4. I
CCD_01_MAX
and I
CCD_23_MAX
refers only to the processor current draw and does not account for the current consumption by
the memory devices. Memory Standby Current is characterized by design and not tested.
5. Minimum V
CC
and maximum I
CC
are specified at the maximum processor case temperature (T
CASE
). I
CC_MAX
is specified at the
relative V
CC_MAX
point on the V
CC
load line. The processor is capable of drawing I
CC_MAX
for up to 5 seconds. Refer to
Figure 7-3 for further details on the average processor current draw over various time durations.
Table 7-11. Current Specifications
Parameter Symbol and Definition
Processor TDP / Core
Count
TDC (A) Max (A) Notes
1
I
CC
Core Supply, Processor Current on V
CC
130W 6-core, 4-core 135 165 4, 5
I
TT
I/O Termination Supply, Processor Current on
V
TTA
/V
TTD
130W 6-core, 4-core 20 24 4, 5
I
SA
System Agent Supply, Processor Current on
V
SA
130W 6-core, 4-core 20 24 4, 5
I
CCD_01
DDR3 Supply, Processor Current V
CCD_01
130W 6-core, 4-core 3 4 4, 5
I
CCD_23
DDR3 Supply, Processor Current V
CCD_23
130W 6-core, 4-core 3 4 4, 5
I
CCPLL
PLL Supply, Processor Current on V
CCPLL
130W 6-core, 4-core 2 2 4, 5
I
CCD_01_23,
I
CCD_23_23
DDR3 Supply, Current
on V
CCD_01/
V
CCD_23
in System S3 Standby
State
130W 6-core, 4-core — 0.5 4