Filter
Top Products
Datasheet, Volume 1 21
Introduction
Storage Conditions
A non-operational state. The processor may be installed in a platform, in a tray, or
loose. Processors may be sealed in packaging or exposed to free air. Under these
conditions, processor landings should not be connected to any supply voltages, have
any I/Os biased or receive any clocks. Upon exposure to “free air” (that is, unsealed
packaging or a device removed from packaging material) the processor must be
handled in accordance with moisture sensitivity labeling (MSL) as indicated on the
packaging material.
SVID Serial Voltage IDentification interface
TAC Thermal Averaging Constant
TAP Test Access Point
TCC Thermal Control Circuit
TDC Thermal Design Current
TDP Thermal Design Power
TLP Transaction Layer Packet
V
AXG
Graphics core power supply
V
CC
Processor core power supply
V
CCIO
High Frequency I/O logic power supply
V
CCPLL
PLL power supply
V
CCSA
System Agent (memory controller, DMI, PCIe controllers, and display engine) power
supply
V
DDQ
DDR3 power supply
VGA Video Graphics Array
VID Voltage Identification
VLD Variable Length Decoding
VLW Virtual Legacy Wire
VR Voltage Regulator
V
SS
Processor ground
VTS Virtual Temperature Sensor
x1 Refers to a Link or Port with one Physical Lane.
x16 Refers to a Link or Port with sixteen Physical Lanes.
x4 Refers to a Link or Port with four Physical Lanes.
x8 Refers to a Link or Port with eight Physical Lanes.
Table 1-2. Terminology (Sheet 3 of 3)
Term Description