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8.0 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard using the LGA1150 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor
thermal solutions, such as a heatsink. The following figure shows a sketch of the
processor package components and how they are assembled together.
The package components shown in the following figure include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 20. Processor Package Assembly Sketch
8.1 Processor Component Keep-Out Zone
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude
into the required keep-out zones. Decoupling capacitors are typically mounted to the
land-side of the package substrate. Refer to the LGA1150 Socket Application Guide for
keep-out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in. This keep-in
zone includes solder paste and is a post reflow maximum height for the components.
8.2
Package Loading Specifications
The following table provides dynamic and static load specifications for the processor
package. These mechanical maximum load limits should not be exceeded during
heatsink assembly, shipping conditions, or standard use condition. Also, any
Package Mechanical Specifications—Processor
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
June 2013 Datasheet – Volume 1 of 2
Order No.: 328907-001 101