Filter
Top Products
Performance Targets
The following table provides boundary conditions and performance targets as guidance
for thermal solution design. Thermal solutions must be able to comply with the
Maximum T
CASE
Thermal Profile.
Table 20. Boundary Conditions, Performance Targets, and T
CASE
Specifications
Processor PCG
2
Package
TDP
3
Platform
TDP
4
Heatsink
5
T
LA
,
Airflow,
RPM,
Ѱ
CA
6
Maximum
T
CASE
Thermal
Profile
7
T
CASE-MAX
@
Platform
TDP
8
4C/GT2 95 W
1
Workstation
2013D
84 W 87 W
Active Cu
Core (DHA-A)
40 °C,
3100 RPM,
0.383 °C/W
y = 0.33 *
Power + 45.0
73.7 °C
4C/GT2 95 W
1
84 W 87 W
1U Al
Heatpipe
40 °C,
11.5 CFM,
0.383 °C/W
73.7 °C
4C/GT0 95 W
1
80 W 82 W
1U Al
Heatpipe
42 °C,
11.5 CFM,
0.383 °C/W
y = 0.33 *
Power + 46.6
73.6 °C
4C/GT0 80 W
1
80 W 80 W
1U Al
Heatpipe
42 °C,
11.5 CFM,
0.383 °C/W
73.0 °C
4C/GT2 65 W
1
2013C 65 W 65 W
Active Al
Core (DHA-B)
40 °C,
3100 RPM,
0.487 °C/W
y = 0.41 *
Power + 44.7
71.3 °C
4C/GT1 45 W
1
2013B 45 W 45 W
Active Short
(DHA-D)
44.5 °C,
3000 RPM,
0.597 °C/W
y = 0.51 *
Power + 48.5
71.4 °C
continued...
Processor—Thermal Management
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2 June 2013
68 Order No.: 328907-001