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Table 52. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
8.7 Processor Markings
The following figure shows the top-side markings on the processor. This diagram aids
in the identification of the processor.
Figure 21. Processor Top-Side Markings
8.8 Processor Land Coordinates
The following figure shows the bottom view of the processor package.
Package Mechanical Specifications—Processor
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
June 2013 Datasheet – Volume 1 of 2
Order No.: 328907-001 103