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1.4 Thermal Management Support
• Digital Thermal Sensor
• Adaptive Thermal Monitor
• THERMTRIP# and PROCHOT# support
• On-Demand Mode
• Memory Open and Closed Loop Throttling
• Memory Thermal Throttling
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Render Thermal Throttling
• Fan speed control with DTS
1.5 Package Support
The processor socket type is noted as LGA 1150. The package is a 37.5 x 37.5 mm
Flip Chip Land Grid Array (FCLGA 1150). See the appropriate Processor Thermal
Mechanical Design Guidelines and LGA1150 Socket Application Guide for complete
details on the package.
1.6 Terminology
Table 1. Terminology
Term Description
APD Active Power-down
B/D/F Bus/Device/Function
BGA Ball Grid Array
BLC Backlight Compensation
BLT Block Level Transfer
BPP Bits per pixel
CKE Clock Enable
CLTM Closed Loop Thermal Management
DDI Digital Display Interface
DDR3 Third-generation Double Data Rate SDRAM memory technology
DLL Delay-Locked Loop
DMA Direct Memory Access
DP DisplayPort*
DTS Digital Thermal Sensor
EC Embedded Controller
ECC Error Correction Code
continued...
Processor—Introduction
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2 June 2013
12 Order No.: 328907-001