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Chapter 5: Subsystem Maintenance
Subsystem Maintenance 5-3
5.1.2 General Notes on Component Replacement
All of the components on the subsystem, including the RAID controllers,
PSU modules, cooling modules, and drive trays, are hot-swappable and can
be changed while the subsystem is still in operation.
Qualified engineers who are familiar with the subsystem should be the only
ones who make component replacements. If you are not familiar with the
subsystem and/or with RAID subsystem maintenance in general, it is
strongly advised that you refer subsystem maintenance to a suitably
qualified maintenance engineer.
Normalized airflow is directly dependent upon the presence of all
subsystem components. Even if a subsystem component fails, it should not
be removed from the subsystem until a replacement is readily at hand and
can be quickly installed. Removing a subsystem component without
replacing it can lead to permanent subsystem damage.
When replacing any hot-swappable component, caution should be taken to
ensure that the components are handled in an appropriate manner. Rough or
improper handling of components can lead to irreparable damage.
WARNING!
When inserting a removable module, DO NOT USE EXCESSIVE
FORCE! Forcing or slamming a module into the chassis can damage the
connector pins on the module or the backplane. Gently push the module in
until it reaches the end of module slot. Once you feel the contact
resistance, use slightly more pressure to ensure the module connectors are
properly mated. Use the extraction levers or retention screws to secure the
module.
5.2. Replacing Controller Module Components
5.2.1 Overview
The controller module consists of the components shown below:
Component Maintenance Procedures
DIMM Module The DIMM module can be replaced when it fails
or if a larger capacity DIMM module is required.