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CY7C601xx, CY7C602xx
Document 38-16016 Rev. *E Page 64 of 68
23. Package Diagrams
Figure 23-1. 24-Pin (300-Mil) SOIC S13
Figure 23-2. 24-Pin (300-Mil) PDIP P13
PIN 1 ID
SEATING PLANE
0.597[15.163]
0.615[15.621]
112
13 24
*
*
*
0.291[7.391]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
PART #
S24.3 STANDARD PKG.
SZ24.3 LEAD FREE PKG.
MIN.
MAX.
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.65gms
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
51-85025 *C
51-85013-*B
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