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S1 C 17xxx F 00E1
Packing specifications
00 : Besides tape & reel
0A : TCP BL 2 directions
0B : Tape & reel BACK
0C : TCP BR 2 directions
0D : TCP BT 2 directions
0E : TCP BD 2 directions
0F : Tape & reel FRONT
0G : TCP BT 4 directions
0H : TCP BD 4 directions
0J : TCP SL 2 directions
0K : TCP SR 2 directions
0L : Tape & reel LEFT
0M : TCP ST 2 directions
0N : TCP SD 2 directions
0P : TCP ST 4 directions
0Q : TCP SD 4 directions
0R : Tape & reel RIGHT
99 : Specs not fixed
Specification
Package
D: die form; F: QFP, B: BGA
Model number
Model name
C: microcomputer, digital products
Product classification
S1: semiconductor
Development tools
S5U1 C 17000 H2 1
Packing specifications
00: standard packing
Version
1: Version 1
Tool type
Hx : ICE
Dx : Evaluation board
Ex : ROM emulation board
Mx : Emulation memory for external ROM
Tx : A socket for mounting
Cx : Compiler package
Sx : Middleware package
Corresponding model number
17xxx: for S1C17xxx
Tool classification
C: microcomputer use
Product classification
S5U1: development tool for semiconductor products
00
00
Configuration of product number