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Design Guide 45
Intel
®
31244 PCI-X to Serial ATA Controller
Printed Circuit Board (PCB) Methodology
6.2.4 Cable Interconnect With Backplane
Figure 14 provides the topology which uses a cable as an interconnect between the motherboard
and backplane.
Table 15. Backplane Stackup, Microstrip
Variable Nominal (mil) Tolerance Min (mil) Max (mil)
Mask Thickness 0.8 +/- 0.2 0.6 1.0
Mask Er 3.6 3.6 3.6
Trace Height 1.4 +/-0.3 1.1 1.7
Preg Er 4.66 +/-0.55 3.6 4.7
Plane Thickness 1.4 +/-0.2 1.2 1.6
Trace Thickness 1.4 +/-0.4 1.0 1.8
Trace Width 11.5 +/-1.5 10 13
Total Thickness 70.0 +/-7.0 63.0 77.0
Table 16. Backplane Stackup, Offset Stripline
Variable Nominal (mil) Tolerance Min (mil) Max (mil)
Mask Thickness 0.8 +/- 0.2 0.6 1.0
Mask Er 3.6 3.6 3.6
Trace Height
1
+/-0.3
Preg Er 4.15 +/-0.55 3.6 4.7
Plane Thickness 2.2 +/-0.2 1.2 1.6
Trace Thickness 1.4 +/-0.4 1.8 2.6
Trace Width 11.5 +/-1.5
Total Thickness 70.0 +/-7.0 63.0 77.0
Table 17. Cable Specification
Parameter Routing Guideline Notes
Characteristic Z - Cable 100 ohms +/- 15%
Trace Length 1”-6”
Trace Matching 150 mils