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Design Guide 77
Intel
®
31244 PCI-X to Serial ATA Controller
Thermal Solutions
Thermal Solutions 15
GD31244 is packaged in a 17 mm, 256-pin Plastic Ball Grid Array (PBGA) in an industry-standard
footprint. The package includes a four layer substrate with power and ground planes. The
construction of the package is shown below. The device is specified for operation when T
C
(case
temperature) is within the range of 0
o
C to 90
o
C, depending on the operating conditions. Refer to
Figure 3 for a details on the package.
15.1 Thermal Recommendations
Based on data Intel gathered while performing thermal validation, the GD31244 does not require a
heat sink. The tests were performed in an environment with no airflow, an ambient temperature of
60° C with the processor executing a maximum power test. However, when the case temperature
(108° C) is exceeded, a passive heat sink may be used.
Table 37. Thermal Resistance
Symbol Description Value Units
T
A
Still air ambient temperature to meet maximum case temperature
specifications: [T
A
= T
C
- (P
DMAX
-θ
ca
)]
70
o
C
θ
ca
Thermal resistance from case to ambient in still air including
conduction through the leads
20
o
C/Watt
Table 38. 544-Lead H-PBGA Package Thermal Characteristics
Thermal Resistance -
o
C/Watt
Parameter
Airflow - ft/min. (M./sec.)
0 100 200 400 600
θ
ca
Thermal Resistance from case to Ambient
20 12.5 11.2 10.2 9.2