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PowerBook G4 (15-inch FW 800_1.5/1.33GHz) Take Apart - 87
Logic Board
4. Important: To prevent damage to the logic board chips, the thermal material between
the logic board and the heatsink must be softened before removing the logic board.
If the computer was run before disassembly, and is still warm, you do not need to
remove the display panel or use the hair dryer. Follow these procedures to release
the logic board:
• Remove the display panel, if not already removed.
• Remove all memory cards and leave the memory door off.
• Verify all screws have been removed.
• Verify all cables are disconnected and moved away from the procedure area
shown below.
• Turn on a 1600 watt hair dryer and set it to high. Move the dryer back and forth
continuously, left to right, about one second per cycle, over the area shown below,
holding it about 20 mm (about 1-inch) above the board, for approximately one and
a half minutes. (The temperature should reach approximately 75-80-degrees C
(167-176-degrees F).)
• After at least 45-seconds, and while continuing to move the hair dryer as described
above, insert a black stick just under the left edge of the logic board, where shown
below, and apply slight upward pressure (do not pry). Continue the hair dryer
procedure along with the slight upward pressure on the board until the thermal
material releases and the board moves up easily.
• Once the thermal material has released, discontinue using the hair dryer.
• Continue to the next step before the thermal material cools.
Warning: Do not use a heat gun, or damage can result.