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Thermal Management Specifications
100 Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
Datasheet Volume One of Two
The temperature reported over PECI is always a negative value and represents a delta
below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT_N
(see Chapter 7, “Electrical Specifications”). Systems that implement fan speed control
must be designed to use this data. Systems that do not alter the fan speed need to
guarantee the case temperature meets the thermal profile specifications.
The processor thermal profiles for planned SKUs are summarized in Section 5.1.3,
“Processor Operational Thermal Specifications.” Thermal profiles ensure adherence to
Intel reliability requirements.
Thermal Profile 2U is representative of a volumetrically unconstrained thermal solution
(that is, industry enabled 2U heatsink). With adherence to the thermal profile, it is
expected that the Thermal Control Circuit (TCC) would be activated for very brief
periods of time when running the most power intensive applications.
Thermal Profile 1U is indicative of a constrained thermal environment (that is, 1U form
factor). Because of the reduced cooling capability represented by this thermal solution,
the probability of TCC activation and performance loss is increased. Additionally,
utilization of a thermal solution that does not meet Thermal Profile 1U will violate the
thermal specifications and may result in permanent damage to the processor. Refer to
the
Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families Thermal /
Mechanical Design Guide for details on system thermal solution design, thermal profiles
and environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) and
the associated T
CASE
value. It should be noted that the upper point associated with
Thermal Profile 1U.
(x = TDP and y = T
CASE_MAX_B
@ TDP) represents a thermal solution design point. In
actuality the processor case temperature will not reach this value due to TCC
activation.
For Embedded Servers, Communications and storage markets Intel has plan SKU’s that
support Thermal Profiles with nominal and short-term conditions for products intended
for NEBS level 3 thermal excursions. For these SKU’s operation at either the nominal or
short-term thermal profiles should result in virtually no TCC activation. Thermal Profiles
for these SKU’s are found in Section 5.1.4, “Embedded Server Thermal Profiles.”
Intel recommends that complete thermal solution designs target the Thermal Design
Power (TDP). The Adaptive Thermal Monitor feature is intended to help protect the
processor in the event that an application exceeds the TDP recommendation for a
sustained time period. To ensure maximum flexibility for future requirements, systems
should be designed to the Flexible Motherboard (FMB) guidelines, even if a processor
with lower power dissipation is currently planned. The Adaptive Thermal Monitor
feature must be enabled for the processor to remain within its specifications.