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Package Mechanical Specifications
210 Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
Datasheet Volume One of Two
9.2 Package Mechanical Drawing (PMD)
The package mechanical drawings are shown as package A size 52.5 mm x 45 mm,
Figure 9-2 and Figure 9-3, and package B size 52.5 mm x 51 mm Figure 9-4 and
Figure 9-5. The drawings include dimensions necessary to design a thermal solution for
the processor. These dimensions include:
1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm.
7. Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the
Intel® Xeon® Processor E5-
1600/2600/4600 v1 and v2 Product Families Thermal / Mechanical Design Guide
.
Table 9-1. Processor Package Sizes
Package Size and Processor TDP SKU Notes
1
Package A: MCC and LCC die size
52.5 mm x 45 mm (Figure 9-2 and Figure 9-3)
150W (8-core)
130W 1U (10/8-core)
130W 2U (8/6/4-core)
130W 1S WS (6/4-core) 2
115W (10-core)
95W (10/8/6/4-core)
80W (6/4-core)
70W (10-core)
60W (6-core)
LV95W-10C
LV70W-10C and LV70W-8C
LV50W-6C
Package B: HCC die size
52.5 mm x 51 mm (Figure 9-4 and Figure 9-5)
130W (12-core)
115W (12-core)
95W (8-core) 2
Notes:
1. Processor SKU’s are subject to change and any processor SKU can be supported in either package size.
2. These SKUs are an Intel® Xeon® processor E5-1600 v2 product family.