Filter
Top Products
Overview
Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families 21
Datasheet Volume One of Two
Intel® Xeon® processor
E5-1600 v2 product family
Intel’s 22-nm processor design, is the follow-on to the 3rd Generation Intel®
Core™ Processor Family design. It is the next generation processor for use in
Intel® Xeon® processor E5-1600 v2/E5-2600 v2 product families-based
platforms. Intel® Xeon® processor E5-1600 v2 product family supports
workstation platforms only.
Intel® Xeon® processor
E5-2600 v2 product family
Intel’s 22-nm processor design, is the follow-on to the 3rd Generation Intel®
Core™ Processor Family design. It is the next generation processor for use in
Intel® Xeon® processor E5-1600 v2/E5-2600 v2 product families-based
platforms. Intel® Xeon® processor E5-2600 v2 product family supports
workstation, Efficient Performance server, and HPC platforms.
Integrated Heat Spreader
(IHS)
A component of the processor package used to enhance the thermal
performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Jitter Any timing variation of a transition edge or edges from the defined Unit Interval
(UI).
IOV I/O Virtualization
LGA2011-0 Socket The LGA2011-0 land FCLGA12 package mates with the system board through
this surface mount, LGA2011-0 contact socket.
LLC Last Level Cache
LRDIMM Load Reduced Dual In-line Memory Module
NCTF Non-Critical to Function: NCTF locations are typically redundant ground or non-
critical reserved, so the loss of the solder joint continuity at end of life conditions
will not affect the overall product functionality.
NEBS Network Equipment Building System. NEBS is the most common set of
environmental design guidelines applied to telecommunications equipment in the
United States.
PCH Platform Controller Hub. The next generation chipset with centralized platform
capabilities including the main I/O interfaces along with display connectivity,
audio features, power management, manageability, security and storage
features.
PCU Power Control Unit
PCI Express* 3.0 The third generation PCI Express* specification that operates at twice the speed
of PCI Express* 2.0 (8 Gb/s); however, PCI Express* 3.0 is completely backward
compatible with PCI Express* 1.0 and 2.0.
PCI Express 3 PCI Express* Generation 3.0
PCI Express 2 PCI Express* Generation 2.0
PCI Express PCI Express* Generation 2.0/3.0
PECI Platform Environment Control Interface
Phit
Physical Unit. An Intel® QPI terminology defining units of transfer at the physical
layer. 1 Phit is equal to 20 bits in ‘full width mode’ and 10 bits in ‘half width
mode’
Processor The 64-bit, single-core or multi-core component (package)
Processor Core The term “processor core” refers to silicon die itself which can contain multiple
execution cores. Each execution core has an instruction cache, data cache, and
256-KB L2 cache. All execution cores share the L3 cache. All DC and signal
integrity specifications are measured at the processor die (pads), unless
otherwise noted.
RDIMM Registered Dual In-line Module
Rank A unit of DRAM corresponding four to eight devices in parallel, ignoring ECC.
These devices are usually, but not always, mounted on a single side of a DDR3
DIMM.
SCI System Control Interrupt. Used in ACPI protocol.
SSE Intel® Streaming SIMD Extensions (Intel® SSE)
Term Description