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Intel® Server Boards S5000PSL and S5000XSL TPS Design and Environmental Specifications
Revision 1.2
Intel order number: D41763-003
79
8. Design and Environmental Specifications
8.1 Server Boards S5000PSL and S5000XSL Design Specifications
The operation of the server boards at conditions beyond those shown in the following table may
cause permanent damage to the system. Exposure to absolute maximum rating conditions for
extended periods may affect system reliability.
Table 37. Server Board Design Specifications
Operating Temperature 0º C to 55º C
1
(32º F to 131º F)
Non-Operating Temperature -40º C to 70º C (-40º F to 158º F)
DC Voltage ± 5% of all nominal voltages
Shock (Unpackaged) Trapezoidal, 50 G, 170 inches / sec
Shock (Packaged)
<20 pounds
20 to <40 pounds
40 to <80 pounds
80 to <100 pounds
100 to <120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged) 5 Hz to 500 Hz 3.13 g RMS random
Note:
1
Chassis design must provide proper airflow to avoid exceeding the Dual-Core Intel
®
Xeon
®
processor 5000 sequence maximum case temperature.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own
chassis development and testing that when Intel server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of air flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.