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1-4 SPARC Enterprise M4000/M5000 Servers Service Manual • August 2009
■ Hold the board by the handle and finger hold panels, where the board stiffener is
located. Do not hold the board at the ends.
■ When removing the board from the packaging, keep the board vertical until you
lay it on the cushioned ESD mat.
■ Do not place the board on a hard surface. Use a cushioned antistatic mat. The
board connectors and components have very thin pins that bend easily.
■ Be careful of small component parts located on both sides of the board.
■ Do not use an oscilloscope probe on the components. The soldered pins are easily
damaged or shorted by the probe point.
■ Transport the board in its packaging box.
Caution – The heat sinks can be damaged by incorrect handling. Do not touch the
heat sinks while replacing or removing boards. If a heat sink is loose or broken,
obtain a replacement board. When storing or shipping a board, ensure that the heat
sinks have sufficient protection.
Caution – On the PCI cassette, when removing cables such as LAN cable, if your
finger can’t reach the latch lock of the connector, press the latch with a flathead
screwdriver to remove the cable. Forcing your finger into the clearance can cause
damage to the PCI card.