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Memory expansion module features and specifications
The following table contains a summary of the features and specifications of the
memory expansion module.
Table 4. MAX5 expansion module features and operating specifications
v Intel 7500 or 7510 scalable memory
buffer (depending on your model)
with eight memory ports (four
DIMMs on each port)
v Xcellerated Memory Technology
v EXA chip set
v QuickPath Interconnect (QPI)
architecture technology:
– Four 6.4 gigatransfers (GT) per
second QuickPath Interconnect
links (for up to 2
microprocessors)
– Three 10.0 GT per second EXA
scalability links
v Scalability:
– Connects to the x3850 X5 and
x3950 X5 (4U) rack servers using
QPI cables
DIMMs:
v Minimum: 2 DIMMs (two 2 GB
DIMMs (4 GB total)
v Maximum: 32 DIMM connectors
(up 1 TB of memory, depending on
the DIMM size)
v Type of DIMMs: PC3-10600R-999,
1333 MHz or PC3-8500R, 1066
MHz, ECC, DDR3 registered
SDRAM dual inline memory
modules (DIMMs)
v Supports 2 GB, 4 GB, 8 GB, 16 GB,
and 32 GB DIMMs
v Supports l.35 V (low-voltage) and
1.5 V registered DIMMs (see
“Installing DIMMs in the memory
expansion module” on page 83 for
more information).
Power supply:
v One or two 675-watt (110 - 220 V
ac auto-sensing) standard
(depending on the model)
v Supports up to two 675-watt (110 -
220 V ac auto-sensing) hot-swap
power supplies with built-in fans
for redundancy support
Light path diagnostics LEDs:
v Board LED
v Configuration LED
v Fan LEDs
v Link LED (for QPI and EXA links)
v Locate LED
v Memory LEDs
v Power-on LEDs
v Power supply LEDs
Chapter 1. The System x3850 X5 and x3950 X5 server 23