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Intel
®
Server Board S5000PAL / S5000XAL TPS Power and Environmental Specifications
Revision 1.4
Intel order number: D31979-007
71
8.2 Server Board Power Requirements
This section provides power supply design guidelines for a system using the Intel
®
Server Board
S5000PAL / S5000XAL, including voltage and current specifications, and power supply on/off sequencing
characteristics. The following diagram shows the power distribution implemented on this server board.
Figure 25. Power Distribution Block Diagram
8.2.1 Processor Power Support
The server board supports the Thermal Design Point (TDP) guideline for Dual-Core Intel
®
Xeon
®
processors 5000 sequence. The Flexible Motherboard Guidelines (FMB) has also been followed to help
determine the suggested thermal and current design values for anticipating future processor needs. The
following table provides maximum values for Icc, TDP power and T
CASE
for the Dual-Core Intel
®
Xeon
®
processor 5000 sequence family.
Table 35. Dual-Core Intel
®
Xeon
®
Processor 5000 Sequence TDP Guidelines per processor
TDP Power Max TCASE Icc MAX
130 W 70º C 150 A
Note: These values are for reference only. The Dual-Core Intel
®
Xeon
®
processor 5000 sequence
Datasheet contains the actual specifications for the processor. If the values found in the Dual-Core Intel
®
Xeon
®
processor 5000 sequence Datasheet are different than those published here, the Dual-Core Intel
®
Xeon
®
processor 5000 sequence Datasheet values will supersede these, and should be used.