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Crown Beach Board
User’s Manual 20
Document Number: 320264
2.5.15 In-Target Probe (ITP) and Debug Support
Crown Beach provides on-board ITP support with an XDP connector. Users can debug
from the reset vector without EFI or OS dependency (up to OS functionality). Ports
80-83 are provided as a troubleshooting tool to monitor POST output during EFI
execution.
Note: ITP requires that the CMC load to configure Poulsbo before register accesses can be
made. The CMC code resides in the FWH on Crown Beach. Thus, it is required that the
FWH flash be programmed and inserted in the FWH socket to use ITP.
Note: Crown Beach does not support ITP 700.
2.5.16 Power Supply Solution
Crown Beach can be powered from an ATX power supply (desktop solution) that
contains all of the voltage regulators necessary to power the system up. Additionally,
virtual battery support is provided through switch SW8A1.
Note: Use an “ATX12V” 1.1 specification compliant power supply regardless of supplier or
wattage level (an "ATX12V" rating means V5 min current =0.1 A, "ATX" V5 min
current = 1.0 A, among other differences). For example, the Sparkle Model No.
FSP300-60BTV meets this requirement and is an ATX12V 1.1 spec compliant power
supply. Depending on the power supply used, Crown Beach may require a load. Crown
Beach provides FETS to assist with this loading through jumpers J4J1 and J5J2, see
Table 9 for jumper settings.
Note: If the power switch on the ATX power supply is used to shut down the system, wait at
least 5 seconds before turning the system on again.
Note: The recommended way to shut down the board is to press and hold the power button
switch (SW3J1) for 5 seconds until the power supply turns off. Using the power supply
switch or pulling the plug out of the wall is not recommended.
2.5.17 Board Size
The reference board form factor is similar to the µATX 9.6 x 10.4 inch (243.84 x
264.16 mm) specification. The back panel jacks may not conform to ATX
specifications.
2.5.18 Board Technology
The Crown Beach reference board uses fine pitched BGA packages, down to
0.0024 inch (0.6 mm) pitch. Type IV high density-interconnect technology is required
for breakout purposes and implemented using a 1-6-1 stack-up (8 layers total).
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