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Thermal Management Specifications
102 Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
Datasheet Volume One of Two
5.1.3 Processor Operational Thermal Specifications
Each SKU has a unique thermal profile that ensures reliable operation for the intended
form factor over the processor’s service life. These specifications are based on final
silicon characterization.
The 130W 1S WS SKUs, which are part of the Intel® Xeon® processor E5-1600 v2
product family, are intended for single processor workstations and utilize workstation
specific use conditions for reliability assumptions.
The 150W WS SKU, which is part of the Intel® Xeon® processor E5-2600 v2 product
family, is intended for dual processor workstations and utilizes workstation specific use
conditions for reliability assumptions.
5.1.3.1 Minimum operating case temperature
Minimum case operating temperature is specified at 5°C for every processor SKU.
5.1.3.2 Maximum operating case temperature thermal profiles
Temperature values are specified at VCC_MAX for all processor frequencies. Systems
must be designed to ensure the processor is not to be subjected to any static VCC and
ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the
electrical loadline specifications in Chapter 7.
Thermal Design Power (TDP) should be used for processor thermal solution design
targets. TDP is not the maximum power that the processor can dissipate. TDP is
measured at specified maximum T
CASE
.
Power specifications are defined at all VID values found in Table 7-3. The processor
may be delivered under multiple VIDs for each frequency. Implementation of a
specified thermal profile should result in virtually no TCC activation. Furthermore,
utilization of thermal solutions that do not meet the specified thermal profile will result
in increased probability of TCC activation and may incur measurable performance loss.
Refer to the
Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families
Thermal / Mechanical Design Guide for system and environmental implementation
details.
Each case temperature thermal profile is unique to each TDP and core count
combination. These T
CASE
profiles are fully defined by the simple linear equation:
T
CASE
= PSI
CA
* P + T
LA
Where:
PSI
CA
is the Case-to-Ambient thermal resistance of the processor thermal solution.
T
LA
is the Local Ambient temperature.
P is the processor power dissipation.
Table 5-1 provides the
PSI
CA
and T
LA
parameters that define T
CASE
thermal profile for
each TDP/Core count combination. Figure 5-1 illustrates the general form of the
resulting linear graph resulting from
T
CASE
= PSI
CA
* P + T
LA
.