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4 Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
Datasheet Volume One of Two
3.2.3 AES Instructions.....................................................................................80
3.2.4 Execute Disable Bit .................................................................................81
3.3 Intel® Secure Key .............................................................................................81
3.4 Intel® OS Guard ...............................................................................................81
3.5 Intel® Hyper-Threading Technology.....................................................................81
3.6 Intel® Turbo Boost Technology ...........................................................................82
3.6.1 Intel® Turbo Boost Operating Frequency ...................................................82
3.7 Enhanced Intel SpeedStep® Technology...............................................................82
3.8 Intel® Intelligent Power Technology.....................................................................83
3.9 Intel® Advanced Vector Extensions (Intel® AVX) ..................................................83
3.10 Intel® Dynamic Power Technology.......................................................................84
4 Power Management .................................................................................................85
4.1 ACPI States Supported .......................................................................................85
4.1.1 System States........................................................................................85
4.1.2 Processor Package and Core States...........................................................85
4.1.3 Integrated Memory Controller States.........................................................86
4.1.4 DMI2/PCI Express* Link States.................................................................87
4.1.5 Intel® QuickPath Interconnect States........................................................87
4.1.6 G, S, and C State Combinations................................................................87
4.2 Processor Core/Package Power Management .........................................................88
4.2.1 Enhanced Intel SpeedStep® Technology....................................................88
4.2.2 Low-Power Idle States.............................................................................88
4.2.3 Requesting Low-Power Idle States ............................................................89
4.2.4 Core C-states.........................................................................................90
4.2.5 Package C-States ...................................................................................91
4.2.6 Package C-State Power Specifications........................................................95
4.2.7 Processor Package Power Specifications.....................................................95
4.3 System Memory Power Management ....................................................................96
4.3.1 CKE Power-Down....................................................................................96
4.3.2 Self Refresh ...........................................................................................97
4.3.3 DRAM I/O Power Management..................................................................97
4.4 DMI2/PCI Express* Power Management................................................................98
5 Thermal Management Specifications ........................................................................99
5.1 Package Thermal Specifications ...........................................................................99
5.1.1 Thermal Specifications.............................................................................99
5.1.2 TCASE and DTS Based Thermal Specifications...........................................101
5.1.3 Processor Operational Thermal Specifications ...........................................102
5.1.4 Embedded Server Thermal Profiles..........................................................106
5.1.5 Thermal Metrology................................................................................109
5.2 Processor Core Thermal Features.......................................................................110
5.2.1 Processor Temperature..........................................................................110
5.2.2 Adaptive Thermal Monitor ......................................................................110
5.2.3 On-Demand Mode.................................................................................112
5.2.4 PROCHOT_N Signal...............................................................................113
5.2.5 THERMTRIP_N Signal ............................................................................113
5.2.6 Integrated Memory Controller (IMC) Thermal Features...............................114
6 Signal Descriptions ................................................................................................117
6.1 System Memory Interface Signals ......................................................................117
6.2 PCI Express* Based Interface Signals.................................................................118
6.3 DMI2/PCI Express* Port 0 Signals......................................................................120
6.4 Intel® QuickPath Interconnect Signals ...............................................................120
6.5 PECI Signal.....................................................................................................121
6.6 System Reference Clock Signals ........................................................................121
6.7 JTAG and TAP Signals.......................................................................................121
6.8 Serial VID Interface (SVID) Signals....................................................................122