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Thermal Management Specifications
106 Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
Datasheet Volume One of Two
5.1.4 Embedded Server Thermal Profiles
Network Equipment Building System (NEBS) is the most common set of environmental
design guidelines applied to telecommunications equipment in the United States.
Embedded server SKU’s target operation at higher case temperatures and/or NEBS
thermal profiles for embedded communications server and storage form factors. The
term “Embedded” is used to refer to those segments collectively. Thermal profiles in
this section pertain only to those specific Embedded SKU’s.
The Nominal Thermal Profile must be used for standard operating conditions or for
products that do not require NEBS Level 3 compliance.
The Short-Term Thermal Profile may only be used for short-term excursions to higher
ambient operating temperatures, not to exceed 96 hours per instance, 360 hours per
year, and a maximum of 15 instances per year, as intended by NEBS Level 3.
Operation at the Short-Term Thermal Profile for durations exceeding 360 hours per year
violate the processor thermal specifications and may result in permanent damage to
the processor.
Implementation of the defined thermal profile should result in virtually no TCC
activation. Refer to the
Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2
Product Families Thermal / Mechanical Design Guide for system and environmental
implementation details.
5.1.4.1 Embedded Operating Case Temperature Thermal Profiles
Thermal Design Power (TDP) should be used for processor thermal solution design
targets. TDP is not the maximum power that the processor can dissipate. TDP is
measured at specified maximum T
CASE
.
Figure 5-2. Digital Thermal Sensor DTS Thermal Profile