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Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families 19
Datasheet Volume One of Two
1.3 Power Management Support
1.3.1 Processor Package and Core States
• ACPI C-states as implemented by the following processor C-states:
— Package: PC0, PC1/PC1e, PC2, PC3, PC6 (Package C7 is not supported)
— Core: CC0, CC1, CC1E, CC3, CC6 (Processor Core C7 is not supported)
• Enhanced Intel SpeedStep® Technology
1.3.2 System States Support
• S0, S1, S3, S4, S5
1.3.3 Memory Controller
• Multiple CKE power down modes
• Multiple self-refresh modes
• Memory thermal monitoring via MEM_HOT_C01_N and MEM_HOT_C23_N Signals
1.3.4 PCI Express*
• L0s is not supported
• L1 ASPM power management capability
1.3.5 Intel® QPI
• L0s is not supported
• L0p and L1 power management capabilities
1.4 Thermal Management Support
• Digital Thermal Sensor with multiple on-die temperature zones
• Adaptive Thermal Monitor
• THERMTRIP_N and PROCHOT_N signal support
• On-Demand mode clock modulation
• Open and Closed Loop Thermal Throttling (OLTT/CLTT) support for system memory
in addition to Hybrid OLTT/CLTT mode
• Fan speed control with DTS
• Two integrated SMBus masters for accessing thermal data from DIMMs
• New Memory Thermal Throttling features via MEM_HOT_C{01/23}_N signals
• Running Average Power Limit (RAPL), Processor and DRAM Thermal and Power
Optimization Capabilities
1.5 Package Summary
The processor socket type is 52.5 x 45 mm or 52.5 x 51 mm FCLGA12 package
(LGA2011-0).