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12 Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
Datasheet Volume One of Two
Some processor features are not available on all platforms. Refer to the Intel® Xeon®
Processor E5 v2 Product Family Specification Update for details of each processor SKU.
The Intel® Xeon® processor E5-1600 v2/E5-2600 v2 product families support these
segments.
• The Intel® Xeon® processor E5-1600 v2 product family is designed for single
processor Workstation platforms only.
• The Intel® Xeon® processor E5-2600 v2 product family is designed for dual
processor Workstation, Efficient Performance server and HPC platforms.
These processors feature per socket, two Intel® QuickPath Interconnect point-to-point
links capable of up to 8.0 GT/s, up to 40 lanes of PCI Express* 3.0 links capable of
8.0 GT/s, and 4 lanes of DMI2/PCI Express* 2.0 interface with a peak transfer rate of
5.0 GT/s. The processor supports up to 46 bits of physical address space and 48-bit of
virtual address space.
Included in this family of processors is an integrated memory controller (IMC) and
integrated I/O (IIO) (such as PCI Express* and DMI2) on a single silicon die. This single
die solution is known as a monolithic processor.
Figure 1-1 shows the processor 2-socket platform configuration. The “Legacy CPU” is
the boot processor that is connected to the PCH component, this socket is set to
NodeID[0].
Low-Core Count 130W 2U E5-2637 v2 4
130W 1S E5-1660 v2
E5-1650 v2
6
130W 1S E5-1620 v2 4
95W 1U E5-2630 v2 6
80W 1U E5-2630 v2
E5-2620 v2
6
80W 1U E5-2609 v2
E5-2603 v2
4
60W 1U E5-2630L v2 6
Table 1-1. HCC, MCC, and LCC SKU Table Summary
Die Size TDP (W) Model Number Core Count
Table 1-2. Volume Structure and Scope (Sheet 1 of 2)
Volume 1: Electrical, Mechanical and Thermal Specification
•Overview
•Interfaces
• Technologies
• Power Management
• Thermal Management Specifications
• Signal Descriptions
• Electrical Specifications
• Processor Land Listing
• Package Mechanical Specifications
• Boxed Processor Specifications
Volume 2: Register Information