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8 Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
Datasheet Volume One of Two
1-3 Referenced Documents.......................................................................................22
2-1 Summary of Processor-specific PECI Commands ....................................................30
2-2 Minor Revision Number Meaning ..........................................................................33
2-3 GetTemp() Response Definition ...........................................................................34
2-4 RdPkgConfig() Response Definition.......................................................................35
2-5 WrPkgConfig() Response Definition ......................................................................37
2-6 RdPkgConfig() & WrPkgConfig() DRAM Thermal and Power Optimization
Services Summary.............................................................................................38
2-7 Channel & DIMM Index Decoding .........................................................................40
2-8 RdPkgConfig() & WrPkgConfig() CPU Thermal and Power Optimization
Services Summary.............................................................................................46
2-9 Power Control Register Unit Calculations ...............................................................50
2-10 RdIAMSR() Response Definition ...........................................................................61
2-11 RdIAMSR() Services Summary12 .........................................................................62
2-12 RdPCIConfig() Response Definition.......................................................................64
2-13 RdPCIConfigLocal() Response Definition................................................................66
2-14 WrPCIConfigLocal() Response Definition................................................................67
2-15 WrPCIConfigLocal() Memory Controller and IIO Device/Function Support...................68
2-16 PECI Client Response During Power-Up.................................................................69
2-17 SOCKET ID Strapping.........................................................................................70
2-18 Power Impact of PECI Commands vs. C-states.......................................................70
2-19 Domain ID Definition..........................................................................................73
2-20 Multi-Domain Command Code Reference...............................................................73
2-21 Completion Code Pass/Fail Mask ..........................................................................74
2-22 Device Specific Completion Code (CC) Definition ....................................................74
2-23 Originator Response Guidelines............................................................................75
2-24 Error Codes and Descriptions...............................................................................76
4-1 System States...................................................................................................85
4-2 Package C-State Support ....................................................................................85
4-3 Core C-State Support.........................................................................................86
4-4 System Memory Power States .............................................................................86
4-5 DMI2/PCI Express* Link States............................................................................87
4-6 Intel® QPI States ..............................................................................................87
4-7 G, S and C State Combinations............................................................................87
4-8 P_LVLx to MWAIT Conversion ..............................................................................90
4-9 Coordination of Core Power States at the Package Level..........................................92
4-10 Package C-State Power Specifications...................................................................95
4-11 Processor Package Power Pmax ...........................................................................95
5-1 TCase Temperature Thermal Specifications..........................................................103
5-2 Digital Thermal Sensor (DTS) Specification Summary ...........................................104
5-3 Embedded TCase Temperature Thermal Specifications ..........................................107
5-4 Embedded DTS Thermal Specifications ...............................................................109
6-1 Memory Channel DDR0, DDR1, DDR2, DDR3 .......................................................117
6-2 Memory Channel Miscellaneous..........................................................................118
6-3 PCI Express* Port 1 Signals ..............................................................................118
6-4 PCI Express* Port 2 Signals ..............................................................................118
6-5 PCI Express* Port 3 Signals ..............................................................................119
6-6 PCI Express* Miscellaneous Signals....................................................................119
6-7 DMI2 and PCI Express Port 0 Signals..................................................................120
6-8 Intel QPI Port 0 and 1 Signals............................................................................120
6-9 Intel QPI Miscellaneous Signals..........................................................................120
6-10 PECI Signals ...................................................................................................121