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Datasheet 3
Contents
1 Introduction.......................................................................................................................11
1.1 Overview .............................................................................................................11
1.2 Processor Abstraction Layer ...............................................................................11
1.3 Mixing Processors of Different Frequencies and Cache Sizes ...........................12
1.4 Terminology.........................................................................................................12
1.5 State of Data .......................................................................................................12
1.6 Reference Documents.........................................................................................13
2 Electrical Specifications....................................................................................................15
2.1 Itanium
®
2 Processor System Bus ......................................................................15
2.1.1 System Bus Power Pins .........................................................................15
2.1.2 System Bus No Connect ........................................................................15
2.2 System Bus Signals ............................................................................................15
2.2.1 Signal Groups.........................................................................................15
2.2.2 Signal Descriptions.................................................................................16
2.3 Package Specifications .......................................................................................17
2.4 Signal Specifications ...........................................................................................18
2.4.1 Maximum Ratings...................................................................................22
2.5 System Bus Signal Quality Specifications and Measurement Guidelines...........23
2.5.1 Overshoot/Undershoot Magnitude .........................................................23
2.5.2 Overshoot/Undershoot Pulse Duration...................................................24
2.5.3 Activity Factor.........................................................................................24
2.5.4 Reading Overshoot/Undershoot Specification Tables............................25
2.5.5 Determining if a System Meets the Overshoot/Undershoot
Specifications .........................................................................................25
2.5.6 Wired-OR Signals...................................................................................28
2.6 Power Pod Connector Signals ............................................................................30
2.7 Itanium
®
2 Processor System Bus Clock and Processor Clocking .....................32
2.8 Recommended Connections for Unused Pins ....................................................35
3 Pinout Specifications........................................................................................................37
4 Mechanical Specifications................................................................................................69
4.1 Mechanical Dimensions ......................................................................................69
4.2 Package Marking.................................................................................................72
4.2.1 Processor Top-Side Marking..................................................................72
4.2.2 Processor Bottom-Side Marking.............................................................72
5 Thermal Specifications.....................................................................................................75
5.1 Thermal Features................................................................................................75
5.1.1 Thermal Alert..........................................................................................75
5.1.2 Enhanced Thermal Management...........................................................76
5.1.3 Thermal Trip...........................................................................................76
5.2 Case Temperature ..............................................................................................76
6 System Management Feature Specifications...................................................................79
6.1 System Management Bus ...................................................................................79
6.1.1 System Management Bus Interface .......................................................79
6.1.2 System Management Interface Signals..................................................79