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Datasheet 69
4 Mechanical Specifications
This chapter provides the mechanical specifications of the Itanium 2 processor.
4.1 Mechanical Dimensions
The Itanium 2 processor package is comprised of an interposer, a processor package substrate, and
an integrated heat spreader (IHS), as illustrated in Figure 4-1. The interposer interfaces with the
socket and the power pod and contains 611 pins which are positioned in a 25 x 28 grid. The IHS,
which is mounted on the top surface of the processor package substrate, efficiently transfers the
heat generated by the die to its surface.
Figure 4-2 contains mechanical drawings and dimensions for the Itanium 2 processor package.
Figure 4-3 contains mechanical drawing for the power tab. All dimensions are measured in mm
and are not to scale.
Figure 4-1. Itanium
®
2 Processor Package
001160e
IHS
Interposer
Processor
Package
Substrate
(OLGA)